NATO AMEDP-4.8 PDF

NATO AMEDP-4.8 PDF

Name:
NATO AMEDP-4.8 PDF

Published Date:
08/29/2018

Status:
[ Active ]

Description:

PRE- AND POST- DEPLOYMENT HEALTH ASSESSMENT

Publisher:
NATO Publication

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

SKU:

Choose Document Language:
Need Help?
VERSION 2 * FREE * ELECTRONIC ONLY

AIM

The aim of this document is to ensure that pre- and post-deployment health assessments are conducted for personnel participating in NATO operations, that these assessments include at least a minimum set of data elements, and that proper action is made on medical findings to ensure that deployed personnel are in good health.


Edition : A
Number of Pages : 22
Published : 08/29/2018

History

NATO AMEDP-4.8
Published Date: 08/29/2018
PRE- AND POST- DEPLOYMENT HEALTH ASSESSMENT
NATO AMEDP-4.8
Published Date: 12/18/2013
PRE- AND POST- DEPLOYMENT HEALTH ASSESSMENT

Related products


Best-Selling Products

IEC/PAS 60027-6 Ed. 1.0 en:2004
Published Date: 09/20/2004
Letter symbols to be used in electrical technology - Control technology
$12.6
IEC/PAS 60050-732 Ed. 1.0 b:2007
Published Date: 06/06/2007
International Electrotechnical Vocabulary - Part 732: Computer network technology
$61.2
IEC/PAS 60092-510 Ed. 1.0 en:2009
Published Date: 04/29/2009
Electrical installations in ships - Part 510: Special features - High-voltage shore connection systems
$89.7
IEC/PAS 60099-7 Ed. 1.0 en:2004
Published Date: 04/27/2004
Surge arresters - Part 7: Glossary of terms and definitions from IEC publications 60099-1, 60099-4, 60099-6, 61643-1, 61643-12, 61643-21, 61643-311, 61643-321, 61643-331 and 61643-341
$95.1
IEC/PAS 60191-6-18 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
$29.1
IEC/PAS 60191-6-19 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage
$32.1