INTERN CEMS D-18 PDF

INTERN CEMS D-18 PDF

Name:
INTERN CEMS D-18 PDF

Published Date:
04/01/2009

Status:
[ Active ]

Description:

Gasketing Materials

Publisher:
International Motors, LLC (Formerly NAVISTAR)

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

SKU:

Choose Document Language:
$9
Need Help?
INCLUDES APPENDIX

This specification covers requirements for nonmetallic, non-asbestos gasketing materials used in products manufactured by the Company. Rubber gasket materials are also specified in Engine Material Specification (EMS) D15-5010.

Restricted Chemical Substances

Effective January 1, 2007, all product supplied to the requirements of this specification must comply with the requirements of the CEMS B-50 specification.


Edition : 09
File Size : 1 file
Number of Pages : 14
Published : 04/01/2009

History

INTERN CEMS D-18
Published Date: 04/01/2009
Gasketing Materials
$9

Related products


Best-Selling Products

IEC/PAS 60027-6 Ed. 1.0 en:2004
Published Date: 09/20/2004
Letter symbols to be used in electrical technology - Control technology
$12.6
IEC/PAS 60050-732 Ed. 1.0 b:2007
Published Date: 06/06/2007
International Electrotechnical Vocabulary - Part 732: Computer network technology
$61.2
IEC/PAS 60092-510 Ed. 1.0 en:2009
Published Date: 04/29/2009
Electrical installations in ships - Part 510: Special features - High-voltage shore connection systems
$89.7
IEC/PAS 60099-7 Ed. 1.0 en:2004
Published Date: 04/27/2004
Surge arresters - Part 7: Glossary of terms and definitions from IEC publications 60099-1, 60099-4, 60099-6, 61643-1, 61643-12, 61643-21, 61643-311, 61643-321, 61643-331 and 61643-341
$95.1
IEC/PAS 60191-6-18 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
$29.1
IEC/PAS 60191-6-19 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage
$32.1