NR NR/CIV/SD/1072 ISSUE C PDF

NR NR/CIV/SD/1072 ISSUE C PDF

Name:
NR NR/CIV/SD/1072 ISSUE C PDF

Published Date:
09/02/2017

Status:
[ Active ]

Description:

Box Girder Underbridge Single Track 2 Girders & Double Track 3 Girders: Main Girders Details 2 - Centre Girders

Publisher:
Network Rail

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

SKU:

Choose Document Language:
$5.7
Need Help?
PDF ONLY


Edition : C
File Size : 1 file , 280 KB
Number of Pages : 2
Published : 09/02/2017

History


Related products

NR NR/SIG/10665/MOD 018 ISSUE 1
Published Date: 03/02/2013
Reliability Centred Maintenance of Signalling Equipment (ROSE) - AC 50 Hz Track Circuit - Service A (NR/ROSE/TC-A1/1)
$7.5
NR NR/L3/OPS/111 ISSUE 4
Published Date: 12/03/2016
Weekly Operating Notice - Format and Content
$13.2
NR T28285 ISSUE 3
Published Date: 02/04/2006
Lineside & on Track Equipment Typical Circuits Signals & Indicators Aspect Sequence; Transition from 3 to 4 aspect; Approach Control Permitted
$5.7
NR NR/L3/OPS/045 ISSUE 28
Published Date: 07/01/2023
National Operating Procedures Index
$18.6

Best-Selling Products

IEC/PAS 60027-6 Ed. 1.0 en:2004
Published Date: 09/20/2004
Letter symbols to be used in electrical technology - Control technology
$12.6
IEC/PAS 60050-732 Ed. 1.0 b:2007
Published Date: 06/06/2007
International Electrotechnical Vocabulary - Part 732: Computer network technology
$61.2
IEC/PAS 60092-510 Ed. 1.0 en:2009
Published Date: 04/29/2009
Electrical installations in ships - Part 510: Special features - High-voltage shore connection systems
$89.7
IEC/PAS 60099-7 Ed. 1.0 en:2004
Published Date: 04/27/2004
Surge arresters - Part 7: Glossary of terms and definitions from IEC publications 60099-1, 60099-4, 60099-6, 61643-1, 61643-12, 61643-21, 61643-311, 61643-321, 61643-331 and 61643-341
$95.1
IEC/PAS 60191-6-18 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
$29.1
IEC/PAS 60191-6-19 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage
$32.1