NR SAO-IEC-HT-20 ISSUE 9 PDF

Introduction

This document provides information on:

• the configuring of VME boards;
• the configuring of PC boards;
• the antistatic precautions to be taken when handling boards and components;
• the insertion and extraction of RAM/EPROM/PROM devices;
• the downloading of programs and data using the CD-ROM facility;
• the fitting and removal of IndustryPacks;
• the replacement of batteries; and
• computer unit identification.

All the boards used in the VME sub-racks and most of the boards used in the PCs can be configured. This allows certain parameters including bus addressing, interrupt priority, memory type and size, and interface connections to be defined. The non self-healing VME backplane can be configured to allow different board positioning and spacing.

In the drawing codes in the following sections:

XXXX is the IECC scheme reference;

YYY represents a standard subsystem abbreviation where the drawing is applicable to more than one subsystem; and

3NN is a number in the 300 series.