ITU-T F.410 FRENCH PDF

Published Date: 11/01/1988

NORMALISATION DES APPAREILS ARYTHMIQUES IMPRIMANT SUR PAGE ET DES MÉTHODES DE COOPÉRATION ENTRE APPAREILS ARYTHMIQUES IMPRIMANT SUR PAGE ET APPAREILS IMPRIMANT SUR BANDE (ATI N° 2)

Published Date: 08/01/2004

Link capacity adjustment scheme (LCAS) for virtual concatenated signals

Published Date: 12/01/2002

Interaction between the Intelligent Network application CS-4 protocol and the Bearer Independent Call Control protocol SERIES Q: SWITCHING AND SIGNALLING Specifications of signalling related to Bearer Independent Call Control (BICC)

Published Date: 01/01/1993

CARACTERÍSTICAS DE LOS CABLES DE CUADRETES EN ESTRELLA DE PARES SIMÉTRICOS CONCEBIDOS PARA ANTERIORES SISTEMAS DE TRANSMISIÓN ANALÓGICOS Y ACTUALMENTE UTILIZADOS PARA LA TRANSMISIÓN DE SISTEMAS DIGITALES A VELOCIDADES BINARIAS DE 6 A 34 Mbit/s

Published Date: 09/20/2004

Letter symbols to be used in electrical technology - Control technology

Published Date: 06/06/2007

International Electrotechnical Vocabulary - Part 732: Computer network technology

Published Date: 04/29/2009

Electrical installations in ships - Part 510: Special features - High-voltage shore connection systems

Published Date: 04/27/2004

Surge arresters - Part 7: Glossary of terms and definitions from IEC publications 60099-1, 60099-4, 60099-6, 61643-1, 61643-12, 61643-21, 61643-311, 61643-321, 61643-331 and 61643-341

Published Date: 01/22/2008

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

Published Date: 01/22/2008

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage