NO-94-07-1 -- Open Chilled Water Systems for Free Cooling - A Simple Concept That Lacks Simplicity PDF

NO-94-07-1 -- Open Chilled Water Systems for Free Cooling - A Simple Concept That Lacks Simplicity PDF

Name:
NO-94-07-1 -- Open Chilled Water Systems for Free Cooling - A Simple Concept That Lacks Simplicity PDF

Published Date:
1994

Status:
Active

Description:

Publisher:
ASHRAE

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

SKU:

Choose Document Language:
$4.8
Need Help?

Explains briefly the fundamental concept of open chilled water systems. Goes on to explore design considerations necessary for the successful application of employing cooling water directly in the chilled water system with or without the use of a heat exchanger. Deals with thermal, chemical and hydraulic phenomena. Concludes that the use of open cooling tower water directly in chilled water systems for winter cooling requires considerably more design attention than simply changing the source by a series of valving. Presents the issues involved in a constructive manner to that the designer can avoid possible problems.

KEYWORDS: Free cooling, chilled water supply, designing, cooling towers, hydraulic installations.


File Size : 1 file , 640 KB
Note : This product is unavailable in Russia, Belarus
Product Code(s) : D-17812
Published : 1994

History


Related products


Best-Selling Products

IEC/PAS 60027-6 Ed. 1.0 en:2004
Published Date: 09/20/2004
Letter symbols to be used in electrical technology - Control technology
$12.6
IEC/PAS 60050-732 Ed. 1.0 b:2007
Published Date: 06/06/2007
International Electrotechnical Vocabulary - Part 732: Computer network technology
$61.2
IEC/PAS 60092-510 Ed. 1.0 en:2009
Published Date: 04/29/2009
Electrical installations in ships - Part 510: Special features - High-voltage shore connection systems
$89.7
IEC/PAS 60099-7 Ed. 1.0 en:2004
Published Date: 04/27/2004
Surge arresters - Part 7: Glossary of terms and definitions from IEC publications 60099-1, 60099-4, 60099-6, 61643-1, 61643-12, 61643-21, 61643-311, 61643-321, 61643-331 and 61643-341
$95.1
IEC/PAS 60191-6-18 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
$29.1
IEC/PAS 60191-6-19 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage
$32.1