SAE AMS3690C PDF

Name:
SAE AMS3690C PDF

Published Date:
07/20/2009

Status:
Active

Description:

Adhesive Compound, Epoxy Room Temperature Curing

Publisher:
SAE International

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

This specification covers a two-component compound, an epoxy resin base and a hardener, in the form of a paste.

This adhesive compound has been used typically for non-structural bonding of metallic alloys and thermosetting plastics to themselves and to each other; it is intended primarily as an adhesive for electrical components nd devices operating at not higher than 185 \mDF (85 \mDC), but usage is not limited to such applications.

File Size :	1 file , 82 KB
Note :	This product is unavailable in Ukraine, Russia, Belarus
Published :	07/20/2009

History

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