SAE AMS6374E PDF

SAE AMS6374E PDF

Name:
SAE AMS6374E PDF

Published Date:
06/18/2020

Status:
Active

Description:

Steel Tubing, Seam-Free, Round 0.95Cr - 0.20Mo (0.28 - 0.33C) (SAE 4130) 95.0 ksi (655 MPa) Tensile Strength

Publisher:
SAE International

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

SKU:

Choose Document Language:
$20.7
Need Help?

This specification covers an aircraft-quality, low-alloy steel in the form of round, non-welded tubing free from OD surface seams.


File Size : 1 file , 150 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 6
Published : 06/18/2020

History

SAE AMS6374E
Published Date: 06/18/2020
Steel Tubing, Seam-Free, Round 0.95Cr - 0.20Mo (0.28 - 0.33C) (SAE 4130) 95.0 ksi (655 MPa) Tensile Strength
$20.7
SAE AMS6374C
Published Date: 01/26/2006
Steel Tubing, Seam-Free, Round, 0.95Cr - 0.20Mo (0.28 - 0.33C) (SAE 4130) 95.0 ksi (655 MPa) Tensile Strength
$18.3

Related products

SAE AMS7510C
Published Date: 05/31/2017
Magnets, Rare-Earth/Cobalt, Permanent Powder-Metallurgy Product (Stabilized: May 2017)
$26.1
SAE AMS4923A
Published Date: 03/15/1966
Titanium Alloy, Bars and Forgings 2cr 2fe 2mo Annealed, 120,000 Psi Yield
$14.7

Best-Selling Products

IEC/PAS 60027-6 Ed. 1.0 en:2004
Published Date: 09/20/2004
Letter symbols to be used in electrical technology - Control technology
$12.6
IEC/PAS 60050-732 Ed. 1.0 b:2007
Published Date: 06/06/2007
International Electrotechnical Vocabulary - Part 732: Computer network technology
$61.2
IEC/PAS 60092-510 Ed. 1.0 en:2009
Published Date: 04/29/2009
Electrical installations in ships - Part 510: Special features - High-voltage shore connection systems
$89.7
IEC/PAS 60099-7 Ed. 1.0 en:2004
Published Date: 04/27/2004
Surge arresters - Part 7: Glossary of terms and definitions from IEC publications 60099-1, 60099-4, 60099-6, 61643-1, 61643-12, 61643-21, 61643-311, 61643-321, 61643-331 and 61643-341
$95.1
IEC/PAS 60191-6-18 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
$29.1
IEC/PAS 60191-6-19 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage
$32.1