SAE ARP1332D PDF

SAE ARP1332D PDF

Name:
SAE ARP1332D PDF

Published Date:
08/12/2013

Status:
Active

Description:

Wave Soldering Procedure (Stabilized: Aug 2013)

Publisher:
SAE International

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Czech version):
200 business days

SKU:
sae-arp1332d_1865753

Choose Document Language:
29.40 €
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The purpose of this recommended practice is to provide recommendations concerning the procedure for wave soldering. The detailed recommendations are based on manufacturing experience and laboratory experiments. The recommendations reflect those design practices and fabricating procedures which have been found to be most effective in producing functional electronic modules for critical communications or control systems. Electronic modules include assemblies, components, and printed circuit (PC) or printed wire (PW) boards. In the following text, references to printed circuit (PC) boards shall be construed to included printed wire (PW) boards.
File Size : 1 file , 51 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Published : 08/12/2013

History


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