SAE AS 6144 PDF

Published Date: 10/17/2011

Sound and Thermal Insulation for Aircraft, General Specification for the Installation of (Stabilized: Oct 2011)

Published Date: 09/01/1997

Sound and Thermal Insulation for Aircraft General Specification for the installation of ( Reaffirmed: Oct 2003 )

Published Date: 02/06/2014

Gas Turbine Engine Power Take-Off Pad Requirements (Stabilized: Feb 2014)

Published Date: 11/09/2020

Retainers (Backup Rings), Hydraulic and Pneumatic, Polytetrafluoroethylene Resin, Single Turn, Scarf-Cut, For Use in AS5857 Static Glands

Published Date: 11/05/2019

Steel, Corrosion-Resistant, Investment Castings 16Cr - 4.1Ni - 0.28Cb (Nb) - 3.2Cu Homogenization, Solution, and Precipitation Heat Treated (H1000) 150 ksi (1034 MPa) Tensile Strength (17-4)

Published Date: 09/20/2004

Letter symbols to be used in electrical technology - Control technology

Published Date: 06/06/2007

International Electrotechnical Vocabulary - Part 732: Computer network technology

Published Date: 04/29/2009

Electrical installations in ships - Part 510: Special features - High-voltage shore connection systems

Published Date: 04/27/2004

Surge arresters - Part 7: Glossary of terms and definitions from IEC publications 60099-1, 60099-4, 60099-6, 61643-1, 61643-12, 61643-21, 61643-311, 61643-321, 61643-331 and 61643-341

Published Date: 01/22/2008

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

Published Date: 01/22/2008

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage