SAE AS4585A PDF

Published Date: 02/22/2018

HOSE ASSEMBLY, PTFE, PARA-ARAMID REINFORCED, STANDARD DUTY, 4000 PSI, 275 °F, TITANIUM FITTINGS, FLARELESS, 90° TO 90° (Stabilized: Feb 2018)

Published Date: 04/21/2015

HOSE ASSEMBLY, PTFE, PARA-ARAMID REINFORCED, STANDARD DUTY, 4000 PSI, 275 °F, TITANIUM FITTINGS, FLARELESS, 90° TO 90°

Published Date: 01/02/2013

HOSE, AIR DUCT, FLEXIBLE, HELICAL, NONMETELLIC WIRE SUPPORTED (COVERED), SILICONE RUBBER, SELF EXTINGUISHING

Published Date: 04/23/2021

Design and Performance Criteria Aircraft Crash Axes

Published Date: 01/20/2022

CONNECTORS, ELECTRICAL, RECTANGULAR, RECEPTACLE, CRIMP CONTACTS, (QUADRUPLE INSERT, TYPE II, CLASS 1 (-65 °C TO +125 °C), SERIES 2, SHELL DESIGNATOR A)

Published Date: 02/15/2019

Thermal Sensitive Inflation Pressure Release Devices for Tubeless Aircraft Wheels

Published Date: 09/20/2004

Letter symbols to be used in electrical technology - Control technology

Published Date: 06/06/2007

International Electrotechnical Vocabulary - Part 732: Computer network technology

Published Date: 04/29/2009

Electrical installations in ships - Part 510: Special features - High-voltage shore connection systems

Published Date: 04/27/2004

Surge arresters - Part 7: Glossary of terms and definitions from IEC publications 60099-1, 60099-4, 60099-6, 61643-1, 61643-12, 61643-21, 61643-311, 61643-321, 61643-331 and 61643-341

Published Date: 01/22/2008

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

Published Date: 01/22/2008

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage