The quantitative comparison of functional properties of no clean solder pastes is key to gauging the competitiveness of a given formulation. Novel methods of determining the printability, spread and slump characteristics, solderability, and solder beading/balling performance for a solder paste are discussed. Residue level determination using TGA and raw paste ion chromatography are included in the benchmarking program to gain an insight into formulation trends in the industry. Performance tradeoffs are revealed and discussed in quest of the ultimate no clean solder paste.
| Number of Pages : | 7 |
| Published : | 11/01/2000 |
