This paper explores successful criteria of surface mount adhesive dispensing systems. The type of dispensing system used must be appropriate to the accuracy, speed, and repeatability requirements balanced to costs for the application. Some typical surface mount adhesive problems must be considered while designing the process or may occur after the SMA process is in place. Many comments concerning surface mount adhesives are also useful for solder paste and silver epoxy dispensing.
| Number of Pages : | 11 |
| Published : | 11/01/2000 |
