SURFACE MOUNT REFLOW PROCESSES ARE BECOMING HIGHLY SOPHISTICATED DUE TO THE HEAT DISPERSION PATTERNS REQUIRED TO SOLDER MULTI-CONFIGURED PRINTED WIRING ASSEMBLIES. ADDITIONALLY, COST CONSIDERATIONS ARE ULTIMATELY THE PRIMARY FACTOR IN DETERMINING WHICH SYSTEM TO SELECT. THIS PAPER DEALS WITH SOME OF THESE ISSUES AND CREATES AN INTEREST IN GENERATING MORE QUESTIONS REGARDING THESE PARTICULAR PROCESSES.
