THIS PAPER REVIEWS SOME OF THE EXISTING PROCESSES FOR MANUFACTURING PRINTED CIRCUIT BOARDS WITH FINE PITCH DEVICES. IT DISCUSSES DESIGN STANDARDS, SOLDER PASTE APPLICATION, PLACEMENT, SOLDERING, AND INSPECTION OF FINE PITCH DEVICES. ALTERNATIVE STENCIL MATERIALS WHICH ENABLE SCREEN PRINTING FOR 0.02 IN. (0.5 MM) DEVICES ARE ALSO DISCUSSED.
