THE FUNDAMENTALS OF STRUCTURAL INDUCTION BONDING FOR TODAY'S ASSEMBLY APPLICATIONS IS PRESENTED. SEVERAL CASE STUDIES, WHERE EXTREMELY FAST CURING OF ADHESIVES VIA INDUCTION HEATING, HAS PROVIDED EFFICIENT AUTOMATED STRUCTURAL BONDING, THE MEANS TO PRODUCE BONDED ASSEMBLIES 36 TIMES FASTER THAN THE QUICKEST REACTIVE MATERIALS WILL BE EXAMINED IN DETAIL. PROCESSING REQUIREMENTS FOR EACH APPLICATION WILL BE DESCRIBED, AS WILL ADVANTAGES AND LIMITATIONS OF THE PROCESS.
| Number of Pages : | 11 |
| Published : | 06/01/1991 |
