SOFTWARE HAS BEEN DESIGNED TO AID THE DESIGN ENGINEER IN THE CHOICE OF A SUITABLE ADHESIVE FOR ANY GIVEN BONDING APPLICATION. THE PROGRAM ASKS A NUMBER OF QUESTIONS ABOUT THE APPLICATION AND ELIMINATES POSSIBLE ADHESIVE CANDIDATES BASED ON THE ANSWERS GIVEN. IT IS ALSO ABLE TO DEAL WITH QUESTIONS OF JOINT DESIGN BASED ON PORTIONS OF THE ADHES PROGRAM DEVELOPED AT UK ATOMIC ENERGY MINISTRY.
