An internal stress (residual stress) of room temperature cured adhesive generated during curing process causes the damage, such as detachment and/or deformation and/or cracking, in the bonded structures. However, a numerical analysis method for the internal stress of room temperature cured adhesive has not been established. In this study, the numerical analysis using the finite element method (FEM) for the internal stress was examined. Good results were obtained in a comparison between calculated and experimental deformation.
| Number of Pages : | 6 |
| Published : | 11/01/1997 |
