Test boards were soldered with various no-clean solder pastes, wave solder fluxes and flux cored wire solders. The boards with their uncleaned flux residues were conformal coated with parylene. They were then subjected to moisture and insulation resistance (MIR) testing using both static and cycling temperature conditions. After final surface insulation resistance (SIR) readings were taken, the boards were examined for corrosion and vesication. Coating adhesion was tested. The boards were then further stressed under autoclave conditions and were re-examined for any further deterioration.
