CONVERTING THE CLEANING PROCESS FOR SMT FROM A SOLVENT (CFC) BASED SYSTEM TO AN ALTERNATIVE METHOD WILL REQUIRE EVALUATION AND THOROUGH TESTING OF BOTH MATERIALS AND EQUIPMENT. ISSUES THAT WILL IMPACT THE CHANGE TO AN AQUEOUS METHOD FOR CLEANING INCLUDE (1) PC BOARD LAYOUT AND COMPONENT DENSITY, (2) CIRCUIT BOARD MATERIALS AND COMPONENT LEAD DESIGN (FORMING), (3) SOLDER PASTE SELECTION AND FLUX, (4) TEST AND EVALUATION OF CLEANING SYSTEMS AND CLEANING MATERIALS. THE DATA SUPPLIED IN THIS PAPER INCLUDES THE PROCEDURE AND RESULTS OF TESTS CONDUCTED AT AN SCI FACILITY.
| Number of Pages : | 11 |
| Published : | 06/01/1992 |
