PERHAPS THE MAJOR ADVANCE BEST ADDRESSING THE CFC ISSUE IN REFLOW SOLDERING HAS BEEN THE DEVELOPMENT OF LOW-RESIDUE NO-CLEAN AND WATER-SOLUBLE SOLDER PASTES PROCESSED IN AMBIENT, INERT OR REACTIVER ATMOSPHERES. WHILE SOME LOW-RESIDUE PASTES FORMULATIONS ARE AVAILABLE THAT WORK WELL IN AIR, CURRENT CONSENSUS IS THAT INERTING IMPROVES SOLDER JOINT QUALITY AND EASES THE CLEANING PROCESS. HOWEVER, MANY CONSIDERATIONS DETERMINE HOW LOW A RESIDUE LEVEL IS REQUIRED AND HOW INERT THE ATMOSPHERE NEEDS TO BE.
| Number of Pages : | 10 |
| Published : | 06/01/1992 |
