PIGMENTED, AS WELL AS CLEAR ENCAPSULANTS THAT CURE IN SECONDS SIGNIFICANTLY LOWER MANUFACTURING COSTS BY ELMINATING LONG BAKE CYCLES, OFF-LINE CURING AND EXTRA HANDLING. LOW MODULUS POLYMERS PROVIDE ENCAPSULATION AND UNDERFILL PROTECTION BY MINIMIZING DIFFERENTIAL STRESS ON THE DIFFERENT, YET ADJACENT MATERIALS USED IN CHIP CONSTRUCTION.
