THIS TECHNICAL REPORT IS A RESULT OF A ROUNDTABLE ORGANIZED BY THE ASSOCIATION FOR ELECTRONICS MANUFACTURING OF THE SOCIETY OF MANUFACTURING ENGINEERS (EM/SME) ON AUGUST 2, 1990. IT DISCUSSES BOARD MATERIAL PROPERTIES, WARPAGE, DESIGN-FOR-RELIABILITY, DATA TESTING, STANDARD SHAPES, ASSEMBLY, AND FINE PITCH COMPONENT LOCATION ACCURACY. PROGRAM GENERATION AND IMPROVING MANUFACTURING METHODS ARE ALSO DISCUSSED.
