THIS PAPER INTRODUCES THE READER TO NEW DEVELOPMENTS IN TACTILE PROBE SENSORS FOR USE ON COORDINATE MEASURING MACHINES (CMM) MADE POSSIBLE BY THE APPLICATION OF SOLID-STATE STRAIN-GAGE SENSORS AND THE LATEST CUSTOM CHIP AND HYBRID CIRCUIT TECHNIQUES. BASIC ELECTRONIC FUNCTIONS FOR A MINIATURE PROBE SENSOR ARE DISCUSSED AND THE SELECTION OF APPLICATION SPECIFIC INTEGRATED CIRCUITS (ASIC) AND HYBRID CIRCUITS ARE EXPLAINED IN DETAIL, ALONG WITH THEIR LIMITATIONS. THE ADVANTAGES OF COMMUNICATING WITH INTELLIGENT-PROBE SENSORS TO OPTIMISE THE CMM/PROBE SYSTEM PERFORMANCE ARE PRESENTED. THE FUTURE SILICON TECHNOLOGY NEEDED TO ACHIEVE SMALLER INTELLIGENT SENSORS IS ALSO EXPLORED.
| Number of Pages : | 15 |
| Published : | 06/01/1992 |
