THE USAGE OF DIAMOND POLISHING POWDER FOR POLISHING DIAMONDS REQUIRES DEEP UNDERSTANDING AND GOOD KNOWLEDGE OF THE POLISHING PROCESS TO ACQUIRE A HIGH REMOVAL RATE, I.E., HIGH POLISHING RATE. IN THIS RESEARCH, THE POLISHING RATE WAS INVESTIGATED ON THE DIFFERENT DIAMOND PLANES. THE EFFECT OF FRICTION COEFFICIENT WAS FOUND ONCE THE FRICTION COEFFICIENT REACHED THE MAXIMUM VALUE. IT INDICATED THE RIGHT DIRECTION FOR THE MAXIMUM POLISHING RATE. THE SUMMARY OF RESULTS SHOWS THAT THE POLISHING MECHANISM IS DERIVED IN PRINCIPLE FROM A MECHANICAL PROCESS WHICH IS BASED ON AN ADHESIVE WEAR MECHANISM. ONCE A HIGHER TEMPERATURE IS REACHED IN THE CONTACT AREA, ANOTHER POLISHING MECHANISM IS ADDED. THIS POLISHING MECHANISM IS A THERMAL MECHANISM WHICH NORMALLY DEPENDS UPON THE BEHAVIOR OF DIAMONDS AT HIGH TEMPERATURE, WHICH INVOLVES GRAPHITIZATION AND THE RAPID DROP IN MECHANICAL TEMPERATURES. THE
| Number of Pages : | 20 |
| Published : | 06/01/1991 |
