A TECHNIQUE OF POLISHING QUARTZ WAFERS IS PUT FORWARD. THE EXPERIMENTAL RESULTS SHOW THAT BOTH HIGHER QUARTZ REMOVAL RATE AND PERFECTLY POLISHED SUPER SMOOTH SURFACE CAN BE OBTAINED WITHIN THE OPTIMUM RANGE OF THE POLISHING PARAMETERS. THE RESULTS ALSO SHOW THAT THE MATERIAL REMOVAL PROCESS CONTAINS THE INITIATION OF POINT DEFECTS ON THE QUARTZ SURFACE BY THE BONBARDMENT OF PARTICLES AND THE STOCHASTIC FRACTURE AT AN ATOMIC SCALE DUE TO THE BOMBARDMENT. THESE PROCESSES MAY BE CONSIDERED AS THE ESSENTIAL PART OF THE MECHANISM OF ULTRA-FINE FINISHING.
