THIS TECHNICAL PAPER COVERS FOUR MAIN AREAS OF PRECISION CLEANING OF ELECTRONIC ASSEMBLIES DURING MANUFACTURE. IT COVERS THE FUTURE OF VAPOR CLEANING OF THESE ASSEMBLIES AND THE CURRENT REGULATORY SITUATION; THE SEMI-AQUEOUS CLEANING ALTERNATIVES; THE POSSIBILITY OF USING HCFC-141B BASED MATERIALS AS A TEMPORARY REPLACEMENT FOR CFCS IN SEVERAL VERY SPECIALIZED AND LIMITED USAGES; AND THE USE OF LESS HEAVILY REGULATED MATERIALS FOR MISCELLANEOUS PRINTED WIRING ASSEMBLY CLEANING OPERATIONS.
