A material removal mode in ceramics grinding has been developed based on single-point diamond abrasive grinding experiments and analytical investigation. Surface cracks, micro-plastic deformation and recrystallization occurring in ceramics grinding have been studied. The mode has been described as three regions: brittle fracture, non-elastic deformation, and residual damages. The process of grinding ceramics experiences elastic and finitely micro-plastic deformation, crack initiation and propagation, and chip formation.
| Number of Pages : | 6 |
| Published : | 06/01/1997 |
