THIS PAPER DISCUSSES HOW NEW INSTRUMENTATION CAPABLE OF PRODUCING FULL 3-D IMAGES CAN BE USED TO PROVIDE THE REAL TIME HEIGHT OR THICKNESS INFORMATION FOR IMPROVED QUALITY CONTROL DURING THE SURFACE MOUNT MANUFACTURING PROCESS. THE TECHNOLOGY BEHIND LASER BASED 3-D MEASUREMENTS IS FIRST DISCUSSED, FOLLOWED BY A COMPARISON OF VARIOUS CONTACT AND NONCONTACT HEIGHT MEASUREMENT TECHNIQUES. EXAMPLES ARE GIVEN OF A 3-D METROLOGY FOR INSPECTION THICK FILM RESISTORS, SOLDER PASTE, REFLOWED SOLDER, SOLDER MASK, TAPE AUTOMATED BONDING (TAB), IC LEADS, AND CERAMIC PACKAGES. A SPECIFIC EXAMPLE OF YIELD IMPROVEMENTS USING 3-D MEASUREMENTS IS GIVEN.
| Number of Pages : | 8 |
| Published : | 06/01/1990 |
