Lamp infrared (IR) soldering has been used for over 15 years in printed circuit board soldering (fusing). Machines designed for solder fusing are not appropriate for surface mount reflow. Issues such as thermal mass differences, shading, and color selectivity were evident and needed to be overcome to be effective for SMT reflow. Recent developments in lamp IR technology including improved control and enhanced convection have minimized these issues. Lamp IR systems of today utilize a combination of radiant heating and convection heating to more uniformly heat the product.
| Number of Pages : | 6 |
| Published : | 06/01/1990 |
