SOME OF THE FORCES PUSHING TECHNOLOGY TODAY ARE SYSTEM SPEED, RELIABILITY, AND COST OF MANUFACTURING. SYSTEM SPEED HAS BECOME LESS LIMITED BY GATE SPEEDS CAUSING SIGNAL LINE LENGTH TO BE THE DOMINANT FACTOR. SHORTENING THE DISTANCE BETWEEN IC DIES IMPLIES MULTI-CHIP MODULES. RELIABILITY OF CIRCUIT SYSTEMS IS A FUNCTION OF, AMONG OTHER THINGS, THE NUMBER OF INTER-CONNECTIONS WITHIN THE CIRCUIT SYSTEM. RESEARCH NEEDS TO CONTINUE ALONG SEVERAL DIRECTIONS. FUTURE ADVANCES IN SILICON TECHNOLOGY WILL REQUIRE SUBSTANTIAL INVESTMENT. DEVELOPMENT OF THE PACKAGING AND MANUFACTURING SYSTEMS FOR APPLICATION OF IC'S CAN AFFORD GREAT BENEFITS IN TERMS OF OVERALL MODULE COSTS. THE PAPER RECOMMENDS AREAS IN NEED OF FURTHER STUDY FOR THE ATTAINMENT OF SUPERIOR HIGH-VOLUME, LOW-COST ELECTRONICS MODULES FOR FUTURE APPLICATIONS.
| Number of Pages : | 13 |
| Published : | 06/01/1990 |
