FOR PELLET (DIE) BONDER ON SEMICONDUCTOR ASSEMBLY LINES, A VISION SYSTEM DETECTS PARTS POSITIONS AND INSPECTS THE CONDITION OF BONDED PELLETS AUTOMATICALLY. THE IMAGE PROCESSING SOFTWARE IS BASED ON SEGMENTATION AND EDGE DETECTION USING THE EVALUATION OF A GRAY-SCALE IMAGE. CONSEQUENTLY, THIS PELLET BONDER CAN ASSEMBLE PELLETS INTO LEAD-FRAMES PRECISELY. THE ADJUSTMENT TIME FOR THIS MACHINE IS REDUCED WHEN THE PRODUCT TYPE IS CHANGED. THIS MACHINE CAN MONITOR THE APPEARANCE OF ASSEMBLED PARTS, SO INFERIOR GOODS ARE FOUND IMMEDIATELY AND THE YIELD CAN BE INCREASED.
| Number of Pages : | 15 |
| Published : | 06/01/1990 |
