THIS PAPER SHOWS HOW NEW INSTRUMENTATION IS USED TO PROVIDE REAL-TIME HEIGHT OR MATERIAL VOLUME MEASUREMENTS FOR IMPROVED SMT PROCESS CONTROL. EXAMPLES ARE GIVEN OF 3-D METROLOGY FOR INSPECTING THICK FILM RESISTORS, SOLDER PASTE VOLUME, REFLOWED SOLDER, SOLDER MASK, TAPE AUTOMATED BONDING, LEAD COPLANARITY, AND CERAMIC PACKAGES. A SPECIFIC EXAMPLE OF YIELD IMPROVEMENTS USING 3-D MEASUREMENTS IS GIVEN.
