THIS PAPER CENTERS ON ONE APPROACH TO SOLDERING IN AN IN-LINE AUTOMATED FACTORY PLUS A LOOK AT A FINE PITCH DEVICE ROBOTIC TINNING PROCESS. TOPICS WILL INCLUDE SOLDER PASTE COMPOSITION, SOLDER PASTE DEPOSITION, SOLDER REFLOW AND ASSEMBLY CLEANING. ALSO, A FINE PITCH DEVICE PREPARATION AND PLACEMENT CYCLE ARE DISCUSSED WITH RESPECT TO FLUX APPLICATION, SOLDER APPLICATION, AND DEVICE CLEANING.
