AS THE FUNCTIONALITY AND COMPLEXITY OF PRINTED CIRCUIT BOARDS INCREASES, MANUFACTURERS ARE MOVING TO SURFACE MOUNT TECHNOLOGY WITH COMPONENT LEAD PITCHES AS LOW AS 0.2 MM. SOLDER PASTE IS DEPOSITED AT WIDTHS OF 100 MICRONS AND MORE, AND HAS TO BE MONITORED FOR IRREGULARITIES LIKE BRIDGES OR INSUFFICIENT SOLDER DEPOSITION. DIMENSIONAL AND VOLUMETRIC MEASUREMENTS ARE ALSO OF INTEREST AND AID IN PROVIDING A CLOSED-LOOP CONTROL PROCESS FOR SOLDER PRINTING.
| Number of Pages : | 8 |
| Published : | 06/01/1994 |
