The corrugated bond is formed when the starch adhesive is caused to cook in situ by the heat of the corrugator. Consistent bond is required over a range of running conditions, speeds, and materials. Our objective is to (a) make commercially acceptable board, (b) be able to produce board at an established pin adhesive level (T 821 pm-81 provides detailed information about pin adhesive measurements equipment and procedures), (c) use a simple objective technique to make bond evaluations at the time of manufacture that equate closely to laboratory pin adhesion test values, and (d) be able to reduce adhesive consumption levels without jeopardizing bond.
With just a few simple pieces of equipment, one can determine the approximate pin adhesion bond level of combined board. The green peel bond test is a technique of an objective value (on a scale of 4 to 10) to the amount of force required to tear the bond, on the singleface and doubleback side, on a 2-in. wide strip of corrugated bond. The following test takes just a few moments.
