TIA J-STD-028 PDF

This standard establishes the construction detail requirements for bumps and other terminal structures on flip chips and chip scale carriers. All flip chip and chip scale device terminals shall meet the designated standards detailed in this document which includes such diverse terminations as solder bumps, columns, non-melting stand-offs and conductive polymer deposits. The specific standards for different terminations will therefore be appropriately matched to the particular interconnection.

Purpose The purpose of this document is to establish a set of designations and expectations for product performance for the manufacturer and user of flip chip or chip scale devices. Included in this will be the flexibility to implement the best commercial practices and evolving improvements on those practices.