ENCYCLOPEDIA OF PACKAGING MATERIALS, PROCESSES, AND MECHANICS - Set 1 Interconnect and Wafer Bonding Technology (A 4-VOLUME SET) PDF

Name:
ENCYCLOPEDIA OF PACKAGING MATERIALS, PROCESSES, AND MECHANICS - Set 1 Interconnect and Wafer Bonding Technology (A 4-VOLUME SET) PDF

Published Date:
08/27/2019

Status:
[ Active ]

Description:

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

ISBN: 9789811201110

Published Date: 01/01/1989

$15

Published Date: 11/01/1997

Published Date: 01/01/1991

$45.9

Published Date: 10/01/1997

$23.7

Published Date: 01/01/1996

$37.8