ASTM F584-06 PDF

ASTM F584-06 PDF

Name:
ASTM F584-06 PDF

Published Date:
01/01/2006

Status:
Active

Description:

Standard Practice for Visual Inspection of Semiconductor Lead-Bonding Wire

Publisher:
ASTM International

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

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$17.4
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1.1 This practice covers conditions for nondestructive visual inspection of the surface finish of spooled aluminum and gold wire used for making internal semiconductor device connections and hybrid microelectronic connections.

1.2 This practice specifies the recommended lighting, magnification, and specimen positioning for inspecting spooled wire under an optical microscope.

1.3 Photographs ( ) are included in as guides to aid the inspector in identifying particular surface conditions. These photographs are not intended as standards for specifying wire surface quality.

1.4 The values stated in SI units are to be regarded as the standard. The values given in parentheses are for information only.

This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the aplicability of regulatory limitations prior to use.


File Size : 1 file , 370 KB
Note : This product is unavailable in Russia, Ukraine, Belarus
Number of Pages : 7
Published : 01/01/2006

History

ASTM F584-06
Published Date: 01/01/2006
Standard Practice for Visual Inspection of Semiconductor Lead-Bonding Wire
$17.4
ASTM F584-06e1
Published Date: 01/01/2006
Standard Practice for Visual Inspection of Semiconductor Lead-Bonding Wire (Withdrawn 2015)
$17.4
ASTM F584-87(2005)
Published Date: 05/01/2005
Standard Practice for Visual Inspection of Semiconductor Lead-Bonding Wire
$17.4
ASTM F584-87(1999)
Published Date: 06/10/1999
Standard Practice for Visual Inspection of Semiconductor Lead-Bonding Wire
$17.4

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