ASTM F584-87(2005) PDF

ASTM F584-87(2005) PDF

Name:
ASTM F584-87(2005) PDF

Published Date:
05/01/2005

Status:
Active

Description:

Standard Practice for Visual Inspection of Semiconductor Lead-Bonding Wire

Publisher:
ASTM International

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

SKU:

Choose Document Language:
$17.4
Need Help?

1.1 This practice covers conditions for nondestructive visual inspection of the surface finish of spooled aluminum and gold wire used for making internal semiconductor device connections and hybrid microelectronic connections.

1.2 This practice specifies the recommended lighting, magnification, and specimen positioning for inspecting spooled wire under an optical microscope.

1.3 Photographs (Figs. X1-X1.5 ) are included in Appendix X1 as guides to aid the inspector in identifying particular surface conditions. These photographs are not intended as standards for specifying wire surface quality.

1.4 The values stated in SI units are to be regarded as the standard. The values given in parentheses are for information only.

1.5 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the aplicability of regulatory limitations prior to use.


File Size : 1 file , 390 KB
Note : This product is unavailable in Russia, Ukraine, Belarus
Number of Pages : 7
Published : 05/01/2005

History

ASTM F584-06
Published Date: 01/01/2006
Standard Practice for Visual Inspection of Semiconductor Lead-Bonding Wire
$17.4
ASTM F584-06e1
Published Date: 01/01/2006
Standard Practice for Visual Inspection of Semiconductor Lead-Bonding Wire (Withdrawn 2015)
$17.4
ASTM F584-87(2005)
Published Date: 05/01/2005
Standard Practice for Visual Inspection of Semiconductor Lead-Bonding Wire
$17.4
ASTM F584-87(1999)
Published Date: 06/10/1999
Standard Practice for Visual Inspection of Semiconductor Lead-Bonding Wire
$17.4

Related products

ASTM F1513-99(2011)
Published Date: 06/01/2011
Standard Specification for Pure Aluminum (Unalloyed) Source Material for Electronic Thin Film Applications (Withdrawn 2020)
$15.6
ASTM F459-13(2018)
Published Date: 03/01/2018
Standard Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds (Withdrawn 2023)
$22.5
ASTM F1397-93(2020)
Published Date: 04/15/2020
Standard Test Method for Determination of Moisture Contribution by Gas Distribution System Components (Withdrawn 2023)
$24.9
ASTM F1595-00(2020)
Published Date: 09/01/2020
Standard Practice for Viewing Conditions for Visual Inspection of Membrane Switches (Withdrawn 2023)
$19.8

Best-Selling Products

UNE-ISO/PAS 17001:2006 IN
Published Date: 03/15/2006
Conformity assessment. Impartiality. Principles and requirements
UNE-ISO/PAS 17002:2006 IN
Published Date: 03/15/2006
Conformity assessment - Confidentiality -- Principles and requirements
UNE-ISO/PAS 17003:2006 IN
Published Date: 03/15/2006
Conformity assessment - Complaints and appeals -- Principles and requirements
UNE-ISO/PAS 17004:2006 IN
Published Date: 03/15/2006
Conformity assessment. Disclosure of information. Principles and requirements
UNE-ISO/PAS 17005:2009 IN
Published Date: 12/16/2009
Conformity assessment . Use of management systems. Principles and requirements