ASTM F677-13 PDF

ASTM F677-13 PDF

Name:
ASTM F677-13 PDF

Published Date:
04/01/2013

Status:
[ Withdrawn ]

Description:

Standard Test Method for Fluid and Grease Resistance of Thermoset Encapsulating Compounds Used in Electronic and Microelectronic Applications (Withdrawn 2013)

Publisher:
ASTM International

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

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$15
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1.1 This test method determines the resistance of encapsulating compounds to fluids or greases by measuring changes in weight (Note 1) and volume under defined conditions of time and temperature.

Note 1-To provide consistency with the usage in other ASTM test methods concerned with determining the properties of plastic materials, the terms “weight” and “weigh” are used in this test method although the units of measurement are those of mass.

1.2 The values stated in SI units are standard. The values in parentheses are for information only.

Note 2-There is no similar or equivalent IEC standard.

1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. See 9.1.


File Size : 1 file , 67 KB
Note : This product is unavailable in Russia, Ukraine, Belarus
Number of Pages : 3
Published : 04/01/2013
Redline File Size : 2 files , 130 KB

History

ASTM F677-13
Published Date: 04/01/2013
Standard Test Method for Fluid and Grease Resistance of Thermoset Encapsulating Compounds Used in Electronic and Microelectronic Applications (Withdrawn 2013)
$15
ASTM F677-04(2009)
Published Date: 10/01/2009
Standard Test Method for Fluid and Grease Resistance of Thermoset Encapsulating Compounds Used in Electronic and Microelectronic Applications
$15
ASTM F677-04
Published Date: 03/01/2004
Standard Test Method for Fluid and Grease Resistance of Thermoset Encapsulating Compounds Used in Electronic and Microelectronic Applications
$15
ASTM F677-95(1999)
Published Date: 11/10/1999
Standard Test Method for Fluid and Grease Resistance of Thermoset Encapsulating Compounds Used in Electronic and Microelectronic Applications
$15

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