AWWA WQTC62466 PDF

AWWA WQTC62466 PDF

Name:
AWWA WQTC62466 PDF

Published Date:
11/01/2005

Status:
Active

Description:

Canada/US Cooperative Efforts for Source Water Protection in the Great Lakes

Publisher:
American Water Works Association

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

SKU:

Choose Document Language:
$7.2
Need Help?
This slide presentation outlines cooperative efforts between the U.S. and Canada on source water protection in the Great Lakes. Topics covered include: International Joint Commission; international management: Great Lakes; binational collaboration, How it works; vision for the Great Lakes; and, watershed based source water protection.
Edition : Vol. - No.
File Size : 1 file , 1.4 MB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 38
Published : 11/01/2005

History


Related products

AWWA WQTC62403
Published Date: 11/01/2005
LT2 Crypto Removal Credits: Are They Good Enough?
$7.2
AWWA WQTC62425
Published Date: 11/01/2005
Evaluation of Existing Models for Predicting DBP Formation Potential of California State Project Water Treated with a Magnetic Ion Exchange Resin
$7.2
AWWA WQTC62428
Published Date: 11/01/2005
Influence of Amino Acids on DBP Formation in Natural Waters
$7.2
AWWA WQTC62437
Published Date: 11/01/2005
Using Distribution System Modeling to Identify the Potential for Low Pressure Surge Events
$7.2

Best-Selling Products

IEC/PAS 60027-6 Ed. 1.0 en:2004
Published Date: 09/20/2004
Letter symbols to be used in electrical technology - Control technology
$12.6
IEC/PAS 60050-732 Ed. 1.0 b:2007
Published Date: 06/06/2007
International Electrotechnical Vocabulary - Part 732: Computer network technology
$61.2
IEC/PAS 60092-510 Ed. 1.0 en:2009
Published Date: 04/29/2009
Electrical installations in ships - Part 510: Special features - High-voltage shore connection systems
$89.7
IEC/PAS 60099-7 Ed. 1.0 en:2004
Published Date: 04/27/2004
Surge arresters - Part 7: Glossary of terms and definitions from IEC publications 60099-1, 60099-4, 60099-6, 61643-1, 61643-12, 61643-21, 61643-311, 61643-321, 61643-331 and 61643-341
$95.1
IEC/PAS 60191-6-18 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
$29.1
IEC/PAS 60191-6-19 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage
$32.1