Mechanical standardization of semiconductor devices-General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for stacked packages. Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)

Publisher:
British-Adopted European Standard

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

Cross References:
IEC 60191-6
IEC 60191-6-5
EN 60191-6
EN 60191-6-5

All current amendments available at time of purchase are included with the purchase of this document.

File Size :	1 file , 1.4 MB
ISBN(s) :	9780580576218
Note :	This product is unavailable in Ukraine, Russia, Belarus
Number of Pages :	32
Product Code(s) :	30155532, 30155532, 30155532
Published :	06/30/2011

BS EN 60191-6-17:2011 PDF

Mechanical standardization of semiconductor devices-General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for stacked packages. Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)

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