Low prices!
Originals & Translations!
Save your budget and time!
About
Support & Payment
Contacts
Log In
Register
Welcome to ONLINENORMS!
Please,
Log in
or
Create an account
Click View Shopping Cart
Home
BSI
BS 07/30155531 DC PDF
BS 07/30155531 DC PDF
Name:
BS 07/30155531 DC PDF
Published Date:
06/19/2007
Status:
Active
Description:
BS EN 60191-6-17. Mechanical standardization of semiconductor devices. Part 6-17. Design guide for stacked packages and individual stackable packages. Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array Packages (FBGA/FLGA)
Publisher:
BSI Group
Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
Russian
+2,025
English
+
← Please, select the option
Add to Cart
Need Help?
Ask an Expert
Cross References:
IEC 60191-6:1990*IEC 60191-6-5*
Number of Pages :
26
Published :
06/19/2007
History
Related products
BS EN 60749-21:2011
Published Date:
08/31/2011
Semiconductor devices. Mechanical and climatic test methods-Solderability
$79.248
BS EN 60749-27:2006+A1:2012
Published Date:
01/31/2013
Semiconductor devices. Mechanical and climatic test methods-Electrostatic discharge (ESD) sensitivity testing. Machine model (MM)
$57.15
BS EN IEC 60747-16-6:2019
Published Date:
09/02/2019
Semiconductor devices-Microwave integrated circuits. Frequency multipliers
$79.248
Best-Selling Products
Dictionary of Technical Terms : Spanish-English/English-Spanish
Published Date:
01/01/1996
$58.5
Spanish-English Mechanical Engineering Dictionary
Published Date:
01/01/1991
$24
×
Ask a question
Email:
[email protected]
×
Ask a question
Email:
[email protected]