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BS 07/30172404 DC PDF

BS 07/30172404 DC PDF

Name:
BS 07/30172404 DC PDF

Published Date:
12/05/2007

Status:
Active

Description:

BS EN 62047-9. Semiconductor devices. Micro-electromechanical devices. Part 9. Wafer to wafer bonding strength measurement for MEMS

Publisher:
BSI Group

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
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Cross References:
IEC 60068-2-1:1990
IEC 60068-2-81:2003
IEC 60721-2-1:1982
IEC 60721-3-0:1984
IEC 60721-3-1:1997
IEC 60747-1:1983
IEC 60747-14-1:2000
IEC 60749-1:2002
ISO/IEC GUIDE 2:2004


All current amendments available at time of purchase are included with the purchase of this document.

Number of Pages : 11
Published : 12/05/2007

History

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