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BS 2011-2.1TD:1990 PDF

BS 2011-2.1TD:1990 PDF

Name:
BS 2011-2.1TD:1990 PDF

Published Date:
08/31/1990

Status:
Active

Description:

Environmental testing. Tests-Test Td. Solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

Publisher:
BSI Group

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
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Choose Document Language:
$28.194
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Procedure for testing the effects of soldering using a solder bath. Applicable only to products designed to withstand short term immersion in molten solder. To be read in conjunction with Part 1.1

Cross References: BS 2011:Part 1.1*BS 2011:Part 2.1T*BS 2011:Part 2.1Ta*BS 2011:Part 2.2T*

Replaced by BS EN 60068-2-58:1999 but remains current.
File Size : 1 file , 4.2 MB
ISBN(s) : 058018806X
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 16
Product Code(s) : 222184, 222184, 00222184
Published : 08/31/1990

History

BS EN 60068-2-58:2015+A1:2018
BS EN 60068-2-58:2015+A1:2018
Published Date: 05/21/2018
Environmental testing-Tests. Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
$105.156
BS EN 60068-2-58:2004
BS EN 60068-2-58:2004
Published Date: 04/25/2005
Environmental testing-Tests. Test Td. Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
$79.248
BS 2011-2.1TD:1990
BS 2011-2.1TD:1990
Published Date: 08/31/1990
Environmental testing. Tests-Test Td. Solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
$28.194

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