Environmental testing-Tests. Test Td. Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

Publisher:
British-Adopted European Standard

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

Cross References:
IEC 60068-1:1988
IEC 60068-2-20:1979
IEC 60194:1999
IEC 60749-20:2002
IEC 61190-1-1:2002
IEC 61190-1-2:2002
IEC 61190-1-3:2002
IEC 61191-2:1998
IEC 61249-2-7:2002
IEC 61760-1:1998
EN 60068-1:1994
CENELEC HD 323.2.20 S3:1988
EN 60749-20:2003
EN 61190-1-1:2002
EN 61190-1-2:2002
EN 61190-1-3:2002
EN 61191-2:1998
EN 61249-2-7:2002
EN 61760-1:1998
IEC 60068-2-44:1995
IEC 60068-2-54:1985
IEC 60068-2-69:1995

File Size :	1 file , 750 KB
ISBN(s) :	0580447731
Note :	This product is unavailable in Ukraine, Russia, Belarus
Number of Pages :	30
Product Code(s) :	30132671, 30132671, 30132671
Published :	04/25/2005

BS EN 60068-2-58:2004 PDF

Environmental testing-Tests. Test Td. Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

History

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