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BS DD IEC/PAS 62137-3:2008 PDF

BS DD IEC/PAS 62137-3:2008 PDF

Name:
BS DD IEC/PAS 62137-3:2008 PDF

Published Date:
01/31/2009

Status:
Active

Description:

Electronics assembly technology. Selection guidance of environmental and endurance test methods for solder joints

Publisher:
BSI Group

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$105.156
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Cross References:
IEC 60068-1:1988
IEC 60068-1:1988/AMD 1:1988
IEC 60068-2-2:2007
IEC 60068-2-14:1984
IEC 60068-2-14:1984/AMD 1:1986
IEC 60068-2-78:2001
IEC 60194:2006
IEC 61188-5
IEC 61190-1-1:2002
IEC 61190-1-2:2007
IEC 61249-2-7:2002
IEC 62137:2005
IEC 62137-1-1:2007
IEC 62137-1-2:2007
IEC 62137-1-3
IEC 62137-1-4
IEC 62137-1-5


All current amendments available at time of purchase are included with the purchase of this document.
File Size : 1 file , 880 KB
ISBN(s) : 9780580641268
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 46
Product Code(s) : 30187347, 30187347, 30187347
Published : 01/31/2009

History

BS 12/30271778 DC
BS 12/30271778 DC
Published Date: 09/13/2012
BS EN 62137-4. Electronics assembly technology. Endurance test methods for solder joint of area array type package surface mount devices
BS DD IEC/PAS 62137-3:2008
BS DD IEC/PAS 62137-3:2008
Published Date: 01/31/2009
Electronics assembly technology. Selection guidance of environmental and endurance test methods for solder joints
$105.156

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