This part of IEC 60749 describes a test used to determine whether encapsulated solid state
devices used for through-hole mounting can withstand the effects of the temperature to which
they are subjected during soldering of their leads by using wave soldering.
In order to establish a standard test procedure for the most reproducible methods, the solder
dip method is used because of its more controllable conditions. This procedure determines
whether devices are capable of withstanding the soldering temperature encountered in printed
wiring board assembly operations, without degrading their electrical characteristics or internal
connections.
This test is destructive and may be used for qualification, lot acceptance and as a product
monitor.
The heat is conducted through the leads into the device package from solder heat at the
reverse side of the board. This procedure does not simulate wave soldering or reflow heat
exposure on the same side of the board as the package body.
All current amendments available at time of purchase are included with the purchase of this document. | File Size : | 1
file
, 1000 KB |
| ISBN(s) : | 9780539049374 |
| Note : | This product is unavailable in Ukraine, Russia, Belarus |
| Number of Pages : | 16 |
| Product Code(s) : | 30395804, 30395804, 30395804 |
| Published : | 10/01/2020 |
