This part of IEC 60749 establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing.
The test method defines the preconditioning flow for non-hermetic solid-state SMDs representative of a typical industry multiple solder reflow operation.
These SMDs are subjected to the appropriate preconditioning sequence described in this document prior to being submitted to specific in-house reliability testing (qualification and/or reliability monitoring) in order to evaluate long term reliability (impacted by soldering stress).
All current amendments available at time of purchase are included with the purchase of this document. | File Size : | 1
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| ISBN(s) : | 9780539045833 |
| Note : | This product is unavailable in Ukraine, Russia, Belarus |
| Number of Pages : | 18 |
| Product Code(s) : | 30394482, 30394482, 30394482 |
| Published : | 09/30/2020 |
